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Bipolar technology for the manufacture of voltage regulators of positive and negative polarity, one metallization level

範圍 意義
Тип карточки товара Сложная
Application, features NPN  Vertical:

h 21E =(100-300)

UCE >=38V

PNP Lateral:

h 21E>=20

UCE >=38V

Capacitor: n+ - Al

Resistors in layer:

Base; resistor
Process Description Number of masks, pcs.                                                            7-10

Mean design rule,µm                                                                  4-5

Substrate:                 Si/B-doped/ p-type/Thk 460/Res 10/ (111)

Buried layers:                           Si/Sb-doped/ n-type/Thk5/Res25;

                                       Si/Boron-doped/ p-type/Thk 1.6/Res510;

Epi layer:                            Si/P-doped/ n-type/Thk 13,3/ Res 3.6;

Isolation:                                                                          p-n junction

p-base depth, µm                                                                  1,8÷2,8

N+emitter depth, µm                                                             0,9÷2,2

Deep collector, separation and emitter layers have been carried out by method of diffusion

Capacitor dielectric:                                        Si oxide or Si nitride

Interlayer dielectric:                              medium temperature PSG

Metallization:                                                                      Al   1,4 µm

Passivation:                                                 low temp. PSG 1,0 µm
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